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Novel,worldwide first system for removal of adhesive attached Semiconductor and SMD devices.
- Flexible and easy to use
It provides a fast and exact positioning of the component to be removed,preheating of the whole substrate,focused heating of the defective device and building-up of a shear force,necessary for the separation of the component.Depending on component size,the acting of the force can be static,dynamic or combined static and dynamic.
To request product details, please send to Email: info@wiselectronic.com we will provide you service with quality, professional, sincere.
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