The EM-4485 Automatic Die Bonder is designed for eutectic bonding of dice into transistor packages type SOT-23, SOT-89 on an endless tape. Pitch tape feeding, selection of good dice from a semiconductor wafer and die bonding are carried out automatically. Die bonding unit is equipped with a high-speed linear step motor with feedback what ensures high operating speed, accuracy and reliability. Pick-up of dice is run by means of voice coil motor with feedback. Devices are fed to bonding area by reel-to-reel handling system. The bonder uses microprocessor control and diagnostic system that simplifies search and fault elimination.

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