The eutectic or ultrasonic Flip-chip die bonder model PP5-3 is designed for accurate placement of delicate devices on substrate.
It achieves high accuracy placement mixing dual high resolution video cameras.
Placement accuracy is within 1 ¦Ìm.
The machine provides also single collet vacuum pick and place solution, from waffle pack, Gel-Pak or bulk die media .
A robust, and reliable mechanical concept, designed to be external vibration free.
Easy to use, flexible, the PP5-3 requires only minimum training to operate.
To request product details, please send to Email: info@wiselectronic.com we will provide you service with quality, professional, sincere.
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