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Die Bonder PP5

 

Applications:

Pick & Place

Flip chip assembly

very small and large components, IC, capa-chips,

resistor chip...

 

Standard Applications:

MEMS, MMIC, Opto or IR Sensor, Laser diodes, strength gage

 

 

 

To request product details, please send to Email: info@wiselectronic.com we will provide you service with quality, professional, sincere.

 

 

 

 

 

 

     
 
     


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