The die bonder JFP PP400 series is designed for all high density substrate based applications, such as QFN/MLP. A unique maintenance free, high speed transfer head is the heart of the system.

The PP400 series provide customers with the highest quality and best cost/performance system on the market.

Our proven expertise in bonding application effectively provides the technology and support to help our customers.

The PP400 is extremely user friendly and require minimal training to operate.

To request product details, please send to Email: info@wiselectronic.com we will provide you service with quality, professional, sincere.