Emerging assembly technologies tend to reduce the access points available for testing boards. Presently, SMT ultra fine pitch and BGA technology require contacting the board with accuracy and repeatability on any available point: vias, solder pads, pins of components, etc.

Test systems have to be able to perform the test within the limits of the access points available.

The 4040, is designed to meet this challenge! The simple but innovative design of the board holding mechanism, on either the shuttle or in-line system, enables the ease of loading a board while locating the exact z-axis position of the top (probe) side of the board.

With high resolution linear encoders providing feedback of the exact xy-axis position of each probe and the optical encoder on the z-axis probe, the 4040 is able to contact the available points with the resolution and repeatability that can satisfy these emerging technologies.

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