The MicronX platform of thin film measurement systems combine X-ray fluorescence (XRF), a non-contact, non-destructive spectroscopy technique with x-ray collimation to create an instrument ideally suited to the thin film measurement needs of the semiconductor, microelectronics, opto-telecommunications, and data storage industries.

MicronX measures the thickness and composition of up to six layers of deposite metals simultaneously, from angstrom to micron thickness ranges. It can also determine bulk alloy composition for up to twenty elements.

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